2–64升
层数72小时
最快样本0.05毫米
最小行距99.98%
收益率DFM-First 工程 — 高级 PCB 工程师在生产开始前审查每个 Gerber 文件，以确保其可制造性、阻抗控制和热管理。
从消费电子产品到国防系统——我们始终按照最高的可靠性标准进行生产。
Ultra-high density for miniaturized, high-performance electronics
Build Types I–V,Laser Microvias,Any-LayerHybrid circuits for space-constrained, high-reliability systems
2–12 Layers | Polyimide,Coverlay,PSR• Bend radius: 6x material thickness
• Dynamic flex: 500,000+ cycles
• Stiffener integration (FR-4, aluminum)
• Selective coverlay & solder mask
• EMI shielding options
• Smartphone mainboards
• Medical implants
• Aerospace avionics
• AI accelerator cards
• AR/VR headsets
The workhorse of electronics — robust, cost-effective, high-volume ready
2–64 Layers | FR-4 High-Tg,Halogen-Free• Min. trace/space: 0.05mm / 0.05mm
• Min. hole: 0.15mm (mechanical), 0.10mm (laser)
• Aspect ratio up to 20:1
• Blind/buried vias, microvias
• Impedance control ±7%
• Industrial controllers
• Server & networking hardware
• Automotive ECUs
• Medical imaging systems
• Power electronics
Dynamic interconnects for high-flex, high-cycle applications
1–4 Layers | Polyimide,PET,LCP• Single & double-sided flex
• Dynamic bending >1,000,000 cycles
• Coverlay, PSR, adhesiveless
• Stiffeners: FR-4, aluminum, stainless
• Impedance control ±10%
• Foldable smartphone hinges
• Endoscope articulation
• UAV gimbal wiring
• Wearable ECG patches
• High-vibration automotive sensors
High-power thermal management — LED, power electronics, EV systems
1–4 Layers | Aluminum,Copper,Ceramic• Thermal conductivity: 1.0–3.0 W/m·K (Al), 385 W/m·K (Cu)
• Dielectric layer: 75–200μm, 3kV isolation
• Thermal resistance: as low as 0.5°C/W
• Direct bond copper (DBC) for SiC/GaN
• Automotive LED headlights
• EV battery management systems
• Industrial motor drives
• 5G base station RF power amps
• Solar inverters
